Foundry Service

CorEnergy GaN foundry services has provided R&D level foundry service to compound semiconductor customers since 2011. We are capable of performing controlled and reproducible wafer processing service covering most process steps of interest. Advanced process capabilities include laser-lift-off,  MOCVD platters baking, HAST coating, etc.

Some of our process capabilities are listed below:

• * Wafer diameter: 2", 3", 100 mm or 150 mm
• * Lithography: all common positive or negative photo process, contact alignment only
• * Well controlled ICP, PECVD
• * PVD of all commonly used materials
• * Wet processing, including UV etching
• * Processing available for both optical (LED) and electronic (Diode, FET, HBT) products
• * GaAs or GaN semiconductors
• * Common DC measurements, including breakdown voltage measurement upto 5000 V is available
• * Optical RF measurement can be arranged on special request